Development Trend of PCB in New Energy Vehicles
Release time:
2025-11-20
PCB Technology Development Trend under the Electrification of New Energy Vehicles
Driven by the electrification trend of new energy vehicles, the electronic devices and wiring inside vehicles tend to be complex, which puts forward higher performance requirements for vehicle-mounted PCB in terms of integration, high density, multi-layering, lightweight, and reliability
(1) Higher operating voltage: The voltage increases to 800 V (battery), and the insulation distance decreases to less than 100 μm (signal).
(2) Smaller device spacing (about 0.4 mm) and more I/O (about 3,000): The number of necessary layers increases (about 20 layers), the wire/spacing (about 70 μm), and the diameter of via holes decreases (about 80-90 μm for micro vias).
(3) Faster application materials: Controlled impedance and high-speed materials reach 10 Gbit/s and 77 GHz.
(4) Longer operating time: The impact of temperature, humidity, and bias (temperature, humidity, bias testing, THB) increases from 8,000 h to 130,000 h.
(5) Higher temperature load: Increase the temperature load and temperature cycle load at PCB or hot spots (160-175 °C).
PCB Technology Development Trend under the Intelligentization of New Energy Vehicles
(1) Smaller components: The antenna size is 1/3 of that of 24 GHz automotive radar, making it easier to realize a single-chip integrated structure.
(2) Higher target recognition rate: The target recognition rate of 77 GHz automotive radar is three times that of 24 GHz automotive radar, which can more accurately identify objects in the surrounding environment.
(3) More accurate speed measurement and distance measurement: The accuracy rate of speed measurement and distance measurement of 77 GHz automotive radar is 3-5 times higher than that of 24 GHz automotive radar, which can provide more accurate speed and distance information.
(4) High-performance detection: 77 GHz automotive radar has the ability to detect the distance, speed, and angle of objects, and can adapt to various weather and environmental conditions, such as rain, fog, and dust.
(5) Stronger anti-interference ability: 77 GHz automotive radar has good anti-interference ability, which can effectively suppress false targets and improve the stability and reliability of the system.
To enhance the high integration and super computing performance of the intelligent cockpit, the PCB products used inside will be gradually replaced by high-density interconnect (HDI) circuit boards. While improving the integration of the intelligent cockpit, it can also increase the operation and processing speed of core modules such as the in-vehicle entertainment system, autonomous driving main control, and in-vehicle server, realizing the efficient intelligence of new energy vehicles.
Conclusion
Under the dual trend of electrification and intelligentization of new energy vehicles, PCB solutions show a diversified development trend. Evolving from the traditional solution dominated by 4-6 layer multi-layer boards to PCB solutions such as HDI, metal heat dissipation substrates, thick copper substrates, and built-in component boards, higher requirements are put forward for the performance of vehicle-mounted PCBs. In addition, products such as millimeter-wave radar in new energy vehicles have gradually applied a large number of high-frequency PCBs; products such as power batteries and cameras have also begun to use a large number of flexible printed circuits (FPC); LiDAR, intelligent cockpits, electronic control units (ECU), and ADAS systems have a greater demand for HDI boards due to more precise wiring; the proportion of other high-end PCB products is also continuously increasing.
As new energy vehicles develop towards lightweight, high integration, and high-efficiency batteries, higher requirements are continuously put forward for vehicle-mounted PCBs, promoting the rapid update and iteration of PCB technology in new energy vehicles.
by Shangchengwei
Lihai Industrial Park, Baohuan Middle Road, Shatian Town, Dongguan , China.
Room 2314-2315, Zhonghui IFC Nansha District, Guangzhou.
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