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Analysis and Solutions to "Tombstoning" Defects in SMT Soldering Process

With the increasing technical requirements for mounting short, small, light, and thin discrete chip components and integrated circuit (IC) chips on printed circuit boards (PCBs), this paper aims to reduce "tombstoning" defects in the surface mount technology (SMT) soldering process. It analyzes aspects such as PCB pad design, trace-pad connection methods, optical positioning mark design, screen printing and placement accuracy, and temperature profile design, and explores methods and measures to reduce and eliminate component "tombstoning" to improve SMT soldering quality.

Manufacturing Method of 4-Layer 2nd-Order Chip-Embedded HDI Board

With the rapid development of printed circuit board (PCB) technology, various PCBs with embedded components have been widely used. This paper introduces a manufacturing method for a 4-layer 2nd-order chip-embedded high density interconnector (HDI) printed circuit board, including the solutions to the warpage of the asymmetric structure board and the flatness problem of the embedded chip. It shares the manufacturing experience of chip-embedded special PCBs, aiming to provide technical reference for the R&D and production of such special boards.

Development Trend of PCB in New Energy Vehicles

This article focuses on the diversified development and performance upgrading of PCB technology in terms of integration, materials, and application scenarios under the trends of electrification and intelligentization of new energy vehicles, driving the rapid iteration of industry technology.

11-10

2025

Advanced Packaging Substrates: The Cornerstone of AI Chips

Core Support and Development Trends of Electronic Circuits in the AI Era

10-31

2025

How Does One-Stop PCBA Service Reduce Costs by 30%? LEIZZI’s End-to-End Solution from SMT Assembly to Finished Product Testing

Suitable for Medical Electronics/IoT Devices, 45,000 SMT Points Daily Capacity + Full-Process Traceability, Solving PCBA Procurement Fragmentation Issues

10-24

2025

2025 High-Precision PCB Customization Guide: From Requirement Docking to Mass Production Delivery, LEIZZI Helps You Avoid Pitfalls and Improve Efficiency

Focus on Industrial Automation/New Energy Sectors, 3-Day Prototype Delivery + 0.3% Defect Rate, Solving Core PCB Procurement Pain Points

07-17

2025

Stamp Holes in PCB Fabrication: Design Standards, Applications, and Panelization Techniques

stamp holes in PCB fabrication: non-metallized holes (1.0mm diameter, 1.27mm spacing) recessed 0.4mm from edges. Covering types like half-holes and edge-tangent holes, it explains their role in supporting irregular/circular PCBs, enabling clean depanelization, and facilitating modular component integration per IPC standards.

06-24

2025