Development Trend of PCB in New Energy Vehicles
This article focuses on the diversified development and performance upgrading of PCB technology in terms of integration, materials, and application scenarios under the trends of electrification and intelligentization of new energy vehicles, driving the rapid iteration of industry technology.
Advanced Packaging Substrates: The Cornerstone of AI Chips
Core Support and Development Trends of Electronic Circuits in the AI Era
How Does One-Stop PCBA Service Reduce Costs by 30%? LEIZZI’s End-to-End Solution from SMT Assembly to Finished Product Testing
Suitable for Medical Electronics/IoT Devices, 45,000 SMT Points Daily Capacity + Full-Process Traceability, Solving PCBA Procurement Fragmentation Issues
10-24
2025
Focus on Industrial Automation/New Energy Sectors, 3-Day Prototype Delivery + 0.3% Defect Rate, Solving Core PCB Procurement Pain Points
07-17
2025
stamp holes in PCB fabrication: non-metallized holes (1.0mm diameter, 1.27mm spacing) recessed 0.4mm from edges. Covering types like half-holes and edge-tangent holes, it explains their role in supporting irregular/circular PCBs, enabling clean depanelization, and facilitating modular component integration per IPC standards.
06-24
2025
Trusted Partner for High-Mix, Low-to-Medium Volume PCB Assembly Solutions
06-17
2025
leizzi 24-hour support, it partners globally and plans expansion/R&D to lead in innovation.
05-09
2025
Three-in-One of Quality, Price, and Service, Safeguarding Global Customers
04-18
2025
The Factory Open Day Achieves Remarkable Success, and On-site Signings Demonstrate Industry Leadership
04-03
2025
Providing a Comprehensive and Efficient Solution for the Electronics Industry
03-28
2025
This article mainly introduces the business development of LEIZZI in the PCBA field, including the company's technological advantages, service features, and remarkable achievements, demonstrating its important position and influence in the industry.
