Products

Technical Parameters

Item Flexible pcb Rigid-Flexible pcb Rigid PCB 
Max Layer 8L 36L 64L
Inner Layer Min Trace/Space 3/3mil 3/3mil 3/3mil
Out Layer Min Trace/Space 3.5/4mil 3.5/4mil 3/3mil
Inner Layer Max  Copper 2oz 6oz 6oz
Out Layer Max Copper 2oz 3oz 6oz
Min Mechanical Drilling 0.1mm 0.15mm 0.15mm
Min Laser Drilling 0.1mm 0.1mm 0.1mm
Aspect Ratio(Mechanical Drilling) 10:01 12:01 20:01
Aspect Ratio(Laser Drilling) / 1:01 1:01
Press Fit Hole Ttolerance ±0.05mm ±0.05mm ±0.05mm
PTH Tolerance ±0.075mm ±0.075mm ±0.075mm
NPTH Tolerance ±0.05mm ±0.05mm ±0.05mm
Countersink Tolerance ±0.15mm ±0.15mm ±0.15mm
Board Thickness 0.1-0.5mm ±0.1mm 0.4-8mm
Board Thickness Tolerance(＜1.0mm) ±0.05mm ±0.1mm ±0.1mm
Board Thickness Tolerance(≥1.0mm) / ±10% ±10%
Impedance Tolerance Single-Ended：±5Ω(≤50Ω)，±10%(＞50Ω) Single-Ended：±5Ω(≤50Ω)，±10%(＞50Ω) Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω)
Differential：±5Ω(≤50Ω)，±10%(＞50Ω) Differential：±5Ω(≤50Ω)，±10%(＞50Ω) Differential：±5Ω(≤50Ω)，±7%(＞50Ω)
Min Board Size 5*10mm 10*10mm 10*10mm
Max Board Size 9*14inch 22.5*30inch 22.5*30inch
Contour Tolerance ±0.05mm ±0.1mm ±0.1mm
Min BGA 7mil 7mil 7mil
Min SMT 7*10mil 7*10mil 7*10mil
Surface Treatment ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating
Solder Mask Green Solder Mask/Black PI/Yellow PI Green Solder Mask/Black PI/Yellow PI Green,Black,Blue,Red,Matt Green
Min Solder Mask Clearance 3mil 1.5mil 1.5mil
Min Solder Mask Dam 8mil 3mil 3mil
Legend White,Black,Red,Yellow White,Black,Red,Yellow White,Black,Red,Yellow
Min Legend Width/Height 4/23mil 4/23mil 4/23mil
Strain Fillet Width 1.5±0.5mm 1.5±0.5mm /
Bow & Twist / 0.05% 0.30%