Home page

Process Parameter
Areas of Application
Why Choose Us
Accreditation
Packaging & Transportation

Contacts Us

Add: Room 2314-2315, Zhonghui International Financial Center, Nansha District, Guangzhou.

WhatsApp: +86 13828471089

Email:regan@leizzipcb.com

High TG Rigidity PCB

Rigid PCBs also include high-precision PCBs, hard gold finger PCBs, high-frequency PCBs, and small-pitch BGA PCBs. High-precision PCB: A 4-layer PCB with a minimum trace width/space of 3/3 mil and a 5 mil hole-to-line clearance, delivering tight dimensional control for high-accuracy applications. Hard gold finger PCB: A 6-layer gold finger PCB with hard gold plating up to 1.5μm thick. Using etching plating bar technology, it ensures no residual plating bars remain on the gold fingers for reliable contact performance. High-frequency PCB: An 8-layer high-frequency PCB fabricated with a mixed lamination process combining FR4 and high-frequency materials. Warpage is strictly controlled within 0.5% to meet the requirements of IPC-6012 Class Ⅲ. Hard gold finger PCB: Commonly a 6-layer design with hard gold plating up to 1.5μm thick. Manufactured using an etching plating bar process, it guarantees zero residual plating bars on the gold fingers for consistent performance and durability.

Classification:

Keywords:

Email:

Process Parameter

Rigid PCBs also include high-precision PCBs, hard gold finger PCBs, high-frequency PCBs, and small-pitch BGA PCBs.

High-precision PCB: A 4-layer PCB with a minimum trace width/space of 3/3 mil and a 5 mil hole-to-line clearance, delivering tight dimensional control for high-accuracy applications.

Hard gold finger PCB: A 6-layer gold finger PCB with hard gold plating up to 1.5μm thick. Using etching plating bar technology, it ensures no residual plating bars remain on the gold fingers for reliable contact performance.

High-frequency PCB: An 8-layer high-frequency PCB fabricated with a mixed lamination process combining FR4 and high-frequency materials. Warpage is strictly controlled within 0.5% to meet the requirements of IPC-6012 Class Ⅲ.

Item	Rigid PCB
Max Layer	64L
Inner Layer Min Trace/Space	3/3mil
Out Layer Min Trace/Space	3/3mil
Inner Layer Max Copper	6oz
Out Layer Max Copper	6oz
Min Mechanical Drilling	0.15mm
Min Laser Drilling	0.1mm
Aspect Ratio(Mechanical Drilling)	20:01
Aspect Ratio(Laser Drilling)	1:01
Press Fit Hole Ttolerance	±0.05mm
PTH Tolerance	±0.075mm
NPTH Tolerance	±0.05mm
Countersink Tolerance	±0.15mm
Board Thickness	0.4-8mm
Board Thickness Tolerance(＜1.0mm)	±0.1mm
Board Thickness Tolerance(≥1.0mm)	±10%
Impedance Tolerance	Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω)
Impedance Tolerance	Differential：±5Ω(≤50Ω)，±7%(＞50Ω)
Min Board Size	10*10mm
Max Board Size	22.5*30inch
Contour Tolerance	±0.1mm
Min BGA	7mil
Min SMT	7*10mil
Surface Treatment	ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating
Solder Mask	Green,Black,Blue,Red,Matt Green
Min Solder Mask Clearance	1.5mil
Min Solder Mask Dam	3mil
Legend	White,Black,Red,Yellow
Min Legend Width/Height	4/23mil
Strain Fillet Width	/
Bow & Twist	0.30%

Areas of Application

Consumer Electronics

Aerospace

Telecommunications

Military Defense

Automotive Industry

Industrial Control

Why Choose Us ?

One-stop PCB PCBA service

Advanced equipment and technology

24 hours high quality online service

Fast delivery speed

Accreditation

Packaging & Transportation

Static electricity bag+EV pearl cotton

Anti-static bubble bags + carton slot

Carton slot + bubble foam

Anti-static kraft bubble bags

Shipping Way

For small packages, we advise to choose by express (such as DHL, UPS, FedEx, and EMS by door to door service!)is the quickest way.
For heavy packages, the best solution is by seafreight.