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Add: Room 2314-2315, Zhonghui International Financial Center, Nansha District, Guangzhou.

WhatsApp: +86 13828471089

Email:regan@leizzipcb.com

HDI PCB

As electronic devices continue to evolve toward miniaturization, intelligence, and high performance, HDI PCBs (High-Density Interconnect Printed Circuit Boards) have emerged as a key solution to break through the technical limitations of traditional PCBs. HDI PCBs employ advanced manufacturing processes to achieve smaller vias, finer trace routing, and higher layer counts, greatly enhancing component integration and interconnection density to perfectly support the compact requirements of complex electronic designs. Today, HDI PCBs are widely deployed across various high-demand applications, including smartphones, tablets, and other mobile terminals, as well as medical imaging equipment, aerospace control systems, automotive autonomous driving modules, industrial automation equipment, and high-end consumer electronics. In essence, HDI PCBs are the core enabler for meeting the modern electronics industry’s needs for miniaturization, high density, and high performance, driving technological innovation in electronic devices across all sectors.

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Process Parameter

HDI PCBs employ advanced manufacturing processes to achieve smaller vias, finer trace routing, and higher layer counts, greatly enhancing component integration and interconnection density to perfectly support the compact requirements of complex electronic designs. Today, HDI PCBs are widely deployed across various high-demand applications, including smartphones, tablets, and other mobile terminals, as well as medical imaging equipment, aerospace control systems, automotive autonomous driving modules, industrial automation equipment, and high-end consumer electronics.

In essence, HDI PCBs are the core enabler for meeting the modern electronics industry’s needs for miniaturization, high density, and high performance, driving technological innovation in electronic devices across all sectors.

Item	Rigid PCB
Max Layer	64L
Inner Layer Min Trace/Space	3/3mil
Out Layer Min Trace/Space	3/3mil
Inner Layer Max Copper	6oz
Out Layer Max Copper	6oz
Min Mechanical Drilling	0.15mm
Min Laser Drilling	0.1mm
Aspect Ratio(Mechanical Drilling)	20:01
Aspect Ratio(Laser Drilling)	1:01
Press Fit Hole Ttolerance	±0.05mm
PTH Tolerance	±0.075mm
NPTH Tolerance	±0.05mm
Countersink Tolerance	±0.15mm
Board Thickness	0.4-8mm
Board Thickness Tolerance(＜1.0mm)	±0.1mm
Board Thickness Tolerance(≥1.0mm)	±10%
Impedance Tolerance	Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω)
Impedance Tolerance	Differential：±5Ω(≤50Ω)，±7%(＞50Ω)
Min Board Size	10*10mm
Max Board Size	22.5*30inch
Contour Tolerance	±0.1mm
Min BGA	7mil
Min SMT	7*10mil
Surface Treatment	ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating
Solder Mask	Green,Black,Blue,Red,Matt Green
Min Solder Mask Clearance	1.5mil
Min Solder Mask Dam	3mil
Legend	White,Black,Red,Yellow
Min Legend Width/Height	4/23mil
Strain Fillet Width	/
Bow & Twist	0.30%

Areas of Application

Consumer Electronics

Aerospace

Telecommunications

Military Defense

Automotive Industry

Industrial Control

Why Choose Us ?

One-stop PCB PCBA service

Advanced equipment and technology

24 hours high quality online service

Fast delivery speed

Accreditation

Packaging & Transportation

Static electricity bag+EV pearl cotton

Anti-static bubble bags + carton slot

Carton slot + bubble foam

Anti-static kraft bubble bags

Shipping Way

For small packages, we advise to choose by express (such as DHL, UPS, FedEx, and EMS by door to door service!)is the quickest way.
For heavy packages, the best solution is by seafreight.