Contacts Us
Add: Room 2314-2315, Zhonghui International Financial Center, Nansha District, Guangzhou.
Power Amplifier PCB
Process Parameter
Designed to address the thermal challenges of high-power amplification, Power Amplifier PCB integrates advanced thermal management features to ensure long-term reliability under continuous high-power operation. Utilizing metal-core substrates (MCPCB), thick copper layers, and thermally enhanced laminates, it efficiently conducts heat away from power transistors, MOSFETs, and other heat-generating components, preventing thermal runaway and performance degradation.
The PCB’s layout is optimized with isolated power stages, dedicated thermal vias, and large ground planes to maximize heat dissipation and minimize thermal coupling between stages. Surface finishes such as ENIG, immersion tin, or hard gold provide excellent solderability and corrosion resistance, while the robust mechanical structure withstands thermal cycling and mechanical stress. Ideal for industrial RF amplifiers, automotive radar transmitters, and military communication systems, it ensures stable performance in high-temperature, high-power environments.
| Item | Rigid PCB |
| Max Layer | 64L |
| Inner Layer Min Trace/Space | 3/3mil |
| Out Layer Min Trace/Space | 3/3mil |
| Inner Layer Max Copper | 6oz |
| Out Layer Max Copper | 6oz |
| Min Mechanical Drilling | 0.15mm |
| Min Laser Drilling | 0.1mm |
| Aspect Ratio(Mechanical Drilling) | 20:01 |
| Aspect Ratio(Laser Drilling) | 1:01 |
| Press Fit Hole Ttolerance | ±0.05mm |
| PTH Tolerance | ±0.075mm |
| NPTH Tolerance | ±0.05mm |
| Countersink Tolerance | ±0.15mm |
| Board Thickness | 0.4-8mm |
| Board Thickness Tolerance(＜1.0mm) | ±0.1mm |
| Board Thickness Tolerance(≥1.0mm) | ±10% |
| Impedance Tolerance | Single-Ended：±5Ω(≤50Ω)，±7%(＞50Ω) |
| Differential：±5Ω(≤50Ω)，±7%(＞50Ω) | |
| Min Board Size | 10*10mm |
| Max Board Size | 22.5*30inch |
| Contour Tolerance | ±0.1mm |
| Min BGA | 7mil |
| Min SMT | 7*10mil |
| Surface Treatment | ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating |
| Solder Mask | Green,Black,Blue,Red,Matt Green |
| Min Solder Mask Clearance | 1.5mil |
| Min Solder Mask Dam | 3mil |
| Legend | White,Black,Red,Yellow |
| Min Legend Width/Height | 4/23mil |
| Strain Fillet Width | / |
| Bow & Twist | 0.30% |
Areas of Application
Consumer Electronics
Aerospace
Telecommunications
Military Defense
Automotive Industry
Industrial Control
Why Choose Us ?
One-stop PCB PCBA service
Advanced equipment and technology
24 hours high quality online service
Fast delivery speed
Accreditation
Packaging & Transportation
Static electricity bag+EV pearl cotton
Anti-static bubble bags + carton slot
Carton slot + bubble foam
Anti-static kraft bubble bags
Shipping Way
For small packages, we advise to choose by express (such as DHL, UPS, FedEx, and EMS by door to door service!)is the quickest way.
For heavy packages, the best solution is by seafreight.
RELATED
Related Products
MESSAGE
Welcome your product consultation
Lihai Industrial Park, Baohuan Middle Road, Shatian Town, Dongguan , China.
Room 2314-2315, Zhonghui IFC Nansha District, Guangzhou.
Online Message
Copyright 2024 © Guangzhou Leizzi Electronic Technology Co., Ltd. All Rights reserved.