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High Power LED Lighting PCB
Process Parameter
High Power LED Lighting PCB is a thermally optimized printed circuit board specifically engineered for high-brightness LED applications, where efficient heat dissipation, long-term reliability, and stable electrical performance are critical. Built with high-thermal-conductivity substrates—including metal-core PCBs (MCPCB, typically aluminum or copper base), thermally enhanced FR-4, or ceramic substrates (Al₂O₃, AlN)—it efficiently transfers heat away from high-power LED chips (1W–300W+), preventing thermal degradation, lumen depreciation, and premature failure.
Featuring thick copper traces (1–4oz+), dedicated thermal vias, and optimized thermal pad designs, this PCB minimizes thermal resistance and ensures uniform heat distribution across the board. The multi-layer or metal-core structure supports high-current carrying capacity, low voltage drop, and stable power delivery to LED arrays, while controlled trace routing and isolation layers reduce electromagnetic interference (EMI) and ensure electrical safety. Surface finishes such as immersion silver, ENIG, or HASL enhance solderability, reflectivity, and corrosion resistance, improving light output and long-term durability.
Compliant with IPC-4101, IPC-6012, and RoHS/REACH standards, High Power LED Lighting PCB operates reliably in a wide temperature range (-40°C to 125°C+) and harsh environments. Ideal for street lighting, stadium floodlights, automotive headlights, industrial high-bay lighting, horticultural grow lights, and high-end commercial lighting, it delivers exceptional thermal management, electrical stability, and optical performance for next-generation high-power LED systems.
| Item | Rigid PCB |
| Max Layer | 64L |
| Inner Layer Min Trace/Space | 3/3mil |
| Out Layer Min Trace/Space | 3/3mil |
| Inner Layer Max Copper | 6oz |
| Out Layer Max Copper | 6oz |
| Min Mechanical Drilling | 0.15mm |
| Min Laser Drilling | 0.1mm |
| Aspect Ratio(Mechanical Drilling) | 20:01 |
| Aspect Ratio(Laser Drilling) | 1:01 |
| Press Fit Hole Ttolerance | ±0.05mm |
| PTH Tolerance | ±0.075mm |
| NPTH Tolerance | ±0.05mm |
| Countersink Tolerance | ±0.15mm |
| Board Thickness | 0.4-8mm |
| Board Thickness Tolerance(<1.0mm) | ±0.1mm |
| Board Thickness Tolerance(≥1.0mm) | ±10% |
| Impedance Tolerance | Single-Ended:±5Ω(≤50Ω),±7%(>50Ω) |
| Differential:±5Ω(≤50Ω),±7%(>50Ω) | |
| Min Board Size | 10*10mm |
| Max Board Size | 22.5*30inch |
| Contour Tolerance | ±0.1mm |
| Min BGA | 7mil |
| Min SMT | 7*10mil |
| Surface Treatment | ENIG,Gold Finger,Immersion Silver,Immersion Tin,HASL(LF),OSP,ENEPIG,Flash Gold;Hard gold plating |
| Solder Mask | Green,Black,Blue,Red,Matt Green |
| Min Solder Mask Clearance | 1.5mil |
| Min Solder Mask Dam | 3mil |
| Legend | White,Black,Red,Yellow |
| Min Legend Width/Height | 4/23mil |
| Strain Fillet Width | / |
| Bow & Twist | 0.30% |
Areas of Application
Consumer Electronics
Aerospace
Telecommunications
Military Defense
Automotive Industry
Industrial Control
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One-stop PCB PCBA service
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Packaging & Transportation
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Anti-static bubble bags + carton slot
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Anti-static kraft bubble bags
Shipping Way
For small packages, we advise to choose by express (such as DHL, UPS, FedEx, and EMS by door to door service!)is the quickest way.
For heavy packages, the best solution is by seafreight.
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