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LEIZZI Breaks Through High-Density PCB Technology Barrier, Leading the Miniaturization Wave of Smart Devices

Release time:

2025-03-12

LEIZZI Breaks Through High-Density PCB Technology Barrier, Leading the Miniaturization Wave of Smart Devices

With continuous advancements in 5G communication, artificial intelligence, and wearable devices, LEIZZI announces the successful mass production of 10-layer third-order PCB boards, marking a new milestone in domestic high-end PCB manufacturing. This technology optimizes blind/buried via design and substrate selection, increasing wiring density by 40% and reducing signal transmission loss by 25%, effectively resolving the core contradiction between miniaturization and high performance in smart devices.

Three Highlights of Technological Innovation

Ultra-Precision Process: Adopts 0.075mm line width/space technology with positive-etching to ensure 5G high-frequency signal integrity.
Heat Dissipation Optimization: Innovates copper foil stacking structure, reducing thermal resistance by 30% to meet high-power demands in servers and automotive electronics.
Green Process Upgrade: Introduces lead-free HASL and water-based coating technologies, cutting carbon emissions by 20% during production.

Application Scenarios and Customer Value
Currently applied in 5G base stations, industrial control equipment, and consumer electronics, this solution helps customers shorten R&D cycles by 30% and reduce production costs by 15%. A leading telecommunications equipment manufacturer using LEIZZI’s solution achieved a 25% reduction in 5G router size and an 18% increase in data throughput.

LEIZZI's Innovation and Upgrade: Elevating the One-Stop PCB/PCBA Service to New Heights

From Raw Materials to Finished Products, an In - Depth Analysis of LEIZZI's PCB Production Process