Rigid pcb also includes high precision pcb,hard gold fingers pcb,high frequency pcb,small saplce bga pcb. The high precision pcb:4 layer pcb with min 3/3mil trace wideth/space and 5 mil space of hole to line. Hard gold fingers pcb: 6 layer gold finger pcb and the hard gold thickness is up to 1.5um by etching plating bar technology to make sure no plating bar remain on gold fingers. High frequency pcb:8 layer high frequency pcb with fr4 and high frequency material mixed lamination technology and well controlling warpage within 0.5% to meet IPC-6012 Class Ⅲ.
High quality fpc pcb board:with high speed transmission current stable,flexible,easy to install,good insulation. Flexible pcba board:export led pcb board,PI material,Electrolytic copper,ultra-thin thickness,can be bent at will. Double side flat cable flex pcb manufacturer:connection line+PI reinforcement+tin spraying process. SINGLE SIDE FLAT CABLE BOARD:Reinforcing material Pl, auxiliary material: conductive adhesive, shielding film,resistance to winding capacity of more than 150,000 times.
Multilayer Rigid Flex PCB is a printed circuit board with multiple circuitry layers. Multilayer flexible PCB uses PI or PET as the substrate. Like rigid multilayer PCBs, multilayer laminate technology makes multilayer FPC. The simplest multilayer flexible PCB is a three-layer flexible PCB formed by covering two copper shielding layers on both sides of a single-sided flexible PCB. This three-layer flexible PCB is equivalent to a coaxial wire or shielded to a wire in electrical performance. The most commonly used multilayer flexible PCB structure is a four-layer structure, which uses metalized holes to realize interlayer interconnection. The middle two layers are generally the power layer and the ground layer. A Multilayer Flex Circuits combine several single-sided or double-sided circuits with complex interconnections, shielding and/or surface mounted technologies in a multi layer design. The Multilayer Flex Circuits may or may not be continuously laminated together throughout the production process. If your design needs require maximum flexibility, continuous lamination may not be appropriate. Multilayer Flex Circuits are an effective solution when confronted with design challenges such as: unavoidable crossovers, specific impedance requirements, elimination of crosstalk, additional shielding and high component density.
When to use Double Sided Rigid-Flex PCB 1. Required when circuit density and layout can not be routed on a single layer 2. Ground and power plane applications 3. Used for shielding applications 4. Dense surface mount assembly 5. Double-Sided Features 6. Component assembly available on both sides 7. Two conductive layers 8. Can be converted into a Sculptured Flex
Rigid pcb also includes high precision pcb,hard gold fingers pcb,high frequency pcb,small saplce bga pcb. The high precision pcb:4 layer pcb with min 3/3mil trace wideth/space and 5 mil space of hole to line. Hard gold fingers pcb: 6 layer gold finger pcb and the hard gold thickness is up to 1.5um by etching plating bar technology to make sure no plating bar remain on gold fingers. High frequency pcb:8 layer high frequency pcb with fr4 and high frequency material mixed lamination technology and well controlling warpage within 0.5% to meet IPC-6012 Class Ⅲ.
Rigid pcb also includes high precision pcb,hard gold fingers pcb,high frequency pcb,small saplce bga pcb. The high precision pcb:4 layer pcb with min 3/3mil trace wideth/space and 5 mil space of hole to line. Hard gold fingers pcb: 6 layer gold finger pcb and the hard gold thickness is up to 1.5um by etching plating bar technology to make sure no plating bar remain on gold fingers. High frequency pcb:8 layer high frequency pcb with fr4 and high frequency material mixed lamination technology and well controlling warpage within 0.5% to meet IPC-6012 Class Ⅲ.
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